Our innovation extends to the development of high-density glass substrates with advanced technologies including through-glass via (TGV) formation, metallization, etching, and precision patterning. These capabilities support next-generation semiconductor packaging solutions and enable integration of glass core–based co-packaged optics for high-performance computing and communication applications. By combining material science expertise with engineering innovation, we provide cutting-edge substrate technologies that support miniaturization, higher signal integrity, and improved thermal and mechanical reliability. Our research and development efforts ensure that customers can access the latest breakthroughs to remain competitive in fast-evolving technology landscapes.
